- By:
- Sullivan, Haley E; Rahman, Obaidullah ; Singanallur Vaidyanathan, Venkatakrishnan ; Ziabari, Amir K
- Page Number:
- 308-313
- Book Title:
- 2024 58th Asilomar Conference on Signals, Systems, and Computers
- Publication Date:
- March 12, 2026
- Publisher Location:
- IEEE, New Jersey, United States of America
- Conference Name:
- ASILOMAR CONFERENCE ON SIGNALS, SYSTEMS, AND COMPUTERS
- Conference Location:
- Pacific Grove, California, United States of America
- Conference Sponsor:
- AMMTO
- View DOI Listing:
- https://doi.org/10.1109/IEEECONF60004.2024.10942638
Abstract
X-ray computed tomography (XCT) is a key tool in non-destructive evaluation of additively manufactured (AM) parts, allowing for internal inspection and defect detection. Despite its widespread use, obtaining high-resolution CT scans can be extremely time consuming. This issue can be mitigated by performing scans at lower resolutions; however, reducing the resolution compromises spatial detail, limiting the accuracy of defect detection. Super-resolution algorithms offer a promising solution for overcoming resolution limitations in XCT reconstructions of AM parts, enabling more accurate detection of defects. While 2D super-resolution methods have demonstrated state-of-the-art performance on natural images, they tend to under-perform when directly applied to XCT slices. On the other hand, 3D super-resolution methods are computationally expensive, making them infeasible for large-scale applications. To address these challenges, we propose a 2.5D super-resolution approach tailored for XCT of AM parts. Our method enhances the resolution of individual slices by leveraging multi-slice information from neighboring 2D slices without the significant computational overhead of full 3D methods. Specifically, we use neighboring low-resolution slices to super-resolve the center slice, exploiting inter-slice spatial context while maintaining computational efficiency. This approach bridges the gap between 2D and 3D methods, offering a practical solution for high-throughput defect detection in AM parts.