March 2026

Conference Paper

Detecting thermal crack growth on a large additive manufactured structure using acoustic emission

By:
Spencer, Ryan J; Nunez, Miguel; Saboonchi, Hossain; Godinez azcuaga, Valery; Vaidya, Uday K; Kunc, Vlastimil ; Hassen, Ahmed A
Page Number:
47-55
Volume:
12047
Issue Number:
120470W-6
Book Title:
Nondestructive Characterization and Monitoring of Advanced Materials, Aerospace, Civil Infrastructure, and Transportation XVI
Publication Date:
March 12, 2026
Publisher Location:
SPIE, Washington, United States of America
Conference Name:
SPIE - Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring
Conference Location:
Long Beach, California, United States of America
Conference Sponsor:
SPIE
View DOI Listing:
https://doi.org/10.1117/12.2615094

Abstract

Large format additive manufacturing (LFAM) proved to have a great potential to become an adjacent technology to traditional manufacturing methods. One of the sectors LFAM is targeting is rapid tool/mold development for composites. This includes large mold structures used for high-temperature molding techniques (in-oven or autoclave). Although, these large printed structures (reaching hundreds of pounds) develop thermal-residual stress during cool-down and can eventually crack, turning the structure into waste. Acoustic emission (AE), a passive non-intrusive global nondestructive evaluation (NDE) technique, was used to monitor crack growth and can provide the right tools that can be used for feedback loop for corrective action. This research performs thermal testing on a large AM mold with preexisting cracks, in an attempt to monitor crack growth using AE. AE was able to detect, identify and locate the crack source by means of acoustic features, waveform characteristics, spectrum analysis, and difference in arrival times.