- By:
- Fabris, Lorenzo ; Hausladen, Paul A; Steinhebel, Amanda L; Charlebois, Serge; Deslandes, Keven; Roy, Nicolas; Vachon, Frederic; Pepin, Catherine; Pratte, Jean-Francois
- Publication Date:
- November 21, 2025
Abstract
The first three-dimensional photon-to-digital converters (3D PDCs) were created by vertically combining wafers obtained from the experimental “beta” run of Single-Photon Avalanche Diodes (SPAD) arrays at Teledyne DALSA with those of the digital readout obtained from a TSMC CMOS foundry run. The Teledyne-DALSA line is capable of producing excellent wafers of SPADs on specific 4-inches wafers, while the TSMC foundry supplied the wafers that host digital readouts. By combining the two wafers, we were able to meet the first milestone of this project, “Construct the first vertically integrated PDC devices.” This report describes the characterization of the devices in order to assess their performance and to identify potential adjustments to fabrication that may be needed in subsequent runs to further improve the process.
