Dr. William F Godoy joined ORNL in 2016, and is a Senior Computer Scientist in the Computational Science and Mathematics Division, CSMD. A native of Peru, his background is in Mechanical Engineering with research interests on high-performance computing (HPC), programming models, workflows, energy in computing, and AI for HPC.
Dr. Godoy obtained his PhD (2009) and MS (2006) degrees from the State University of New York at Buffalo, working under the supervision of Dr. Paul E. DesJardin on 3D radiative transfer parallel computational models. Before ORNL, he was a a Senior Software Engineer at Intel Co. (2012-2016) using HPC for the R&D of thermal-reliability models for chip designs; and a postdoctoral fellow at NASA Langley (2009-2012) researching Jacobian-Free Newton Krylov methods and early-adoption of GPU computing for radiative transfer.
At ORNL, Dr. Godoy contributed to the US Department of Energy (DOE) Exascale Computing Project (ECP) as (i) the architect and core developer of the widely-used ADIOS2 library for parallel I/O in HPC, (ii) contributor to the advancement of the QMCPACK software, and (iii) researching novel high-productivity programming for HPC – which led to best papers SC23 WORKS and SC24 XLOOP, and the first paper on applying state-of-the-art large language models (LLMs) to HPC programming. He also worked on improving the file loading times and performance of data reduction workflows impacting users at ORNL neutron science facilities: SNS and HFIR.
Dr. Godoy is currently funded by the US DOE Advanced Scientific Computing Research (ASCR) and serves as co-PI of the Ellora project, and member of Durban, two projects leveraging AI for HPC Software, and the S4PST and Fairbanks projects to advance insutry-funded high-productivity languages (Julia, Mojo, Python) for HPC. Recent efforts include contributions to LLMs for HPC programming: ChatBLAS, ChatHPC; the JACC library to enable performance portability for science users of the Julia language, and a best paper on a first study of the Mojo language for science. He also serves as a mentor on several internship programs and technical committees in IEEE and ACM venues (IPDPS, HiPC, ICPP, SC, etc.), such as chairing the SC25 reproducibility challenge committee. He is a senior member of IEEE, a member of ACM, and a member of ASME.
Links
Publications
Aug, 2026
Conference Paper
ChatHPC: Building the Foundations for a Productive and Trustworthy AI-Assisted HPC Ecosystem
News
February 2, 2026
5 MIN READ
Power-Capping Metric Evaluation for Improving Energy Efficiency in HPC Applications
February 2, 2026
6 MIN READ
Characterizing GPU Energy Usage in Exascale-Ready Portable Science Application